VeriPac inspection systems utilize an ASTM approved vacuum decay leak test method recognized by the FDA as a consensus standard for package integrity testing. This test method was developed using VeriPac leak test instruments.

Test fixtures are designed to inspect flexible, rigid and semi-rigid packaging including patented tooling designs for Tyvek® trays and pouches.

Real time inspection data is available in numerical, statistical and graphic formats.

VeriPac technology provides non-destructive inspection solutions for off line and on line production applications and QA/QC process control.

225 BLV Non destructive leak detection of multi-cavity blister packaging with defect profile typically >5 microns	225 Leak detection for packages with defect profile typically >25 microns


325 Leak detection for packages with defect profile typically >3 microns	325 LV Micro leak detection Closure integrity testing

225 D Leak detection for packages with defect profile typically >25 microns	325 D Non-destructive micro leak detection for packages with defect profile typically >10 microns

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